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Tech Notes - DuraGrip

Mold Flow Analysis for DuraGrip 6070NC For a .udb file containing this information, please e-mail Armourj@Ferro.com '
General purpose DuraGrip is non-hygroscopic. The bondable 6100 grades are hygroscopic and do require drying.
Overmolding Peel Strength for DuraGrip & Alcryn bonding to various substrates.